FEATURES AND BENEFITS:
- 3mm board-to-board spacing
- .150" minimum pitch between adjacent connectors
- Low-force, solderless installation does not damage PCB
- DC - 40 GHz
- And More!
APPLICATIONS:
- Embedded Computing
- High density stacked PCB applications
- High density multiport applications
Download our Application Note HERE
View the entire product line: SV Microwave. 3mm Board-to-Board Interconnects