SV'S NEW 3MM BOARD-TO-BOARD INTERCONNECT-FIND OUT MORE TODAY!

FEATURES AND BENEFITS:

• 3mm board-to-board spacing
• .150" minimum pitch between adjacent connectors
• Low-force, solderless installation does not damage PCB
• DC - 40 GHz
• And More!

APPLICATIONS:

• Embedded Computing
• High density stacked PCB applications
• High density multiport applications

Download our Application Note.

View the entire product line: SV Microwave 3mm Board-to-Board Interconnects