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SMPS Male PCB Edge Launch Connector, FD
Part Number 3811-40003
Product Images
Inventory Status
| Part # | In Stock At | QTY | ORDER | RFQ |
|---|---|---|---|---|
| 3811-40003 | Digi-Key Electronics | 102 | RFQ | |
| 3811-40003 | Mouser Electronics | 150 On Order | RFQ | |
| 3811-40003 | A.E. Petsche Company | 100 | RFQ | |
| 3811-40003 | Arrow Electronics Inc | 5 | RFQ | |
| 3811-40003 | TTI Inc Global Headquarters | 50 | RFQ |
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| *Technical specifications are generic to the product series and are not part number specific. | |||
| Electrical | |||
| Impedance | 50Ω | ||
| Frequency | 65 GHz | ||
| VSWR | 1.10:1 to 26.5 GHz typ.; 1.25:1 to 65 GHz typ. | ||
| Insertion Loss | .07 √ f (GHz) | ||
| Shielding Effectiveness | ≥ -80 dB typ. | ||
| Dielectric Withstanding Voltage | 250 VRMS | ||
| Mechanical | |||
| Smooth Bore | Full Detent | ||
| Mating Cycles | 500 | 100 | |
| Force to Engage/Disengage | 1.2 / 1.0 lbs | 2.5 / 4.5 lbs | |
| Axial Misalignment | .010” | ||
| Radial Misalignment | ± .010” | ||
| Environmental | |||
| Temperature Rating | -65°C to +165°C | ||
| Corrosion (Salt Spray) | MIL-STD-202, Method 101, Condition B | ||
| Vibration | MIL-STD-202, Method 204, Condition D, 20 Gs | ||
| Shock | MIL-STD-202, Method 213, Condition I, 100 Gs | ||
| Thermal Shock | MIL-STD-202, Method 107. Cond. B, -65°C to +165°C | ||
| Barometric Pressure (Altitude) | MIL-STD-202, Method 105, Condition C, 70k Ft. | ||
Applications:
- Aerospace
- Military
- Board to board
- Board edge mount to backplane
- High frequency inside the box cable assemblies
- High density multiport connectors and blocks
Features and Benefits
- Blindmate / push on design (RFfortless®)
- 45% less size than the SMP
- 30% less size than the SMPM
- 100 GHz capability
- Full detent and smooth bore options available
- Smaller than Gore 100 & equivalent to G3PO
SV Microwave offers a complete line of SMPS connectors. The SMPS connector utilizes the same great features of the SMP and SMPM connector series in an even more compact package. The SMPS series is ideal in applications where density is of the utmost importance.
